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Capabilities



DS & Multilayer

Item Description Capability
Material & Construction Layer count 2~22 layers
Max. board size. 20″X22″
Finished board thickness 6~125 mil
Tg 130~200℃
Board thickness tolerance <40 mil ± 4.00, >40 mil ± 10%
Lamination Warp & twist 0.70%
Inner layer thickness min 3 mil core + H/H
Board thickness tolerance ±3 mil
Dielectric layer tolerance ±10%
Layer to layer reg. tolerance ±3 mil
Min. thickness of P.P 1080 (3 mil)
First Drill Min. drilled hole 5.9 mil
Hole location tolerance ±2 mil
Tolerance for D1 ±1 mil
Registration D0→inner layer ±3 mil
D1→datum ±3 mil
D2→D1 ±3 mil
S/M to pattern ±3 mil
Layer to layer ±3 mil
Conductors I/L(Min.)width 2.5 mil (1/2 oz)
I/L(Min.)space 2.5 mil (1/2 oz)
O/L(Min.)width(0.5oz for O/L) 2.5 mil (1/2 oz)
O/L(Min.)space(0.5oz for O/L) 2.5 mil (1/2 oz)
I/L W/S(<5mil)deviation ±10%
I/L W/S(≧5mil)deviation ±10%
O/L W/S(<6mil)deviation ±10%
O/L W/S(≧6mil)deviation ±10%
Inner Layer 10 oz
Outer layer finish 4 oz
Copper Plating Aspect ratio FHS ≦ 0.2mm‐‐>1:8, FHS ≦ 0.2mm–>1:10
Min. hole mechanical drill size 5.9 mil
Solder Mask Min. thickness over copper 0.4 mil
Min. thickness at shoulder 0.2 mil
Min. SMD space for dam 7 mil (green)
S/M dam (gloss green/blue) 3 mil
S/M dam (matte) 4 mil
S/M dam (black) 4.5 mil
Max. plugged hole 23.6 mil
Second Drill D2 tolerance ±1 mil
NPTH location tolerance ±2 mil
Finished Hole Tolerance PTH (HAL/LF HAL) ±3 mil
PTH (ENIG/OSP/Imm Ag/Imm Sn) ±2 mil
Hole size reduction after H.A.L 5 mil
Forming Punch ±4 mil
CNC routing ±4 mil
Beveling Beveling angle 20~45°
Tolerance for outline of beveling ±4
V-cut V‐cut angle 30°/60°/90°
Max. board thickness for v‐cut 126 mil
V‐cut residual ±2 mil
V‐cut location ±4 mil
Fixtured Test Voltage 200V
Isolation 10MΩ
Continuity 10Ω
Min. SMD pad pitch 15.7
Flying Probe Test Voltage 250V
Isolation 10MΩ
Continuity 12.7Ω
Min. SMD pad pitch 4 mil
Impedance Control Relative tolerance ±10%
Via Fill (per IPC-4761) Via plug (resin/copper) Max. 24 mil

Metal Core

Item Description Capability
Finish Board Layer count 1-4 layers
Board thickness 0.024″~0.093″
Dimension (Max) 18″ x 24″
Material & Construction FR-4 (TG-135)
PP-Laird (Heat transmit rate 3.0W/m.k) 1KA04~1KA12 (4~12 mil)
PP-ARLON (Heat transmit rate 2.0W/m.k) 92ML0488 (3.4 mil), 92ML0690 (4.4 mil)
5052 Aluminum board 0.016″~0.080″
White silk ink reflect rate >70% Taiyo WT-500
White silk ink reflect rate >90% TeamCham T75W15A
White silk ink discoloration ≦ 3 excursions Taiyo WT-02
Inner Layer Max. working panel size 18” x 24”.
Board thickness 6 mil~60 mil
Max. Cu thickness 2 oz
Min. line width & pitch 3.5 mil/3.5 mil (for H/H oz )
Laminate Finish board thickness general Board thickness tolerance ±10% (thickness < 39.4 mils, ± 4 mil)
Max. operative size 33” x 44”
PP thickness LAIRD 1KA04~1KA12 (4~12 mil), ARLON0488 (3.4 mil) / 0690 (thickness 4.4nmil)
Aluminum board thickness 5052 (0.016″~0.080″)
Planarization Max. width 29.5″
Thickness 0.024″~0.118″
Abrasive Belt Max. width 25″
Thickness 0.016″~0.118″
Drilling Slot lengh : width ≧2.5 mil;if ≦2.5 mil, NPTH long edge + 6 mil﹐PTH long edge + 8 mil
PTH tolerance ± 3 mil(min 2 mil)
NPTH tolerance ±2 mil.
PCB drilling diameter 0.010″~0.250″
Aluminum board drill diameter 0.020″~0.250″
Plating Min. hole diameter 9.8 mil
Min. board thickness 8.4 mil (over Cu)
Min. Cu thickness 0.7 mil
Aspect ratio 6:1
Outer Layer Max. working panel size 18” x 24”
Board thickness 10 mil (over Cu) ~125 mil
Max. etching Cu thickness 2 oz
Min. line width & pitch 4 mil/4 mil
Solder Mask Thickness (over circuit) > 0.4 mil
PITCH ≦16 mil (black/white ink) 5 mil min dam width
Slant 3 mil
Silk Printing S/M pad pitch 3 mil
Slant 2 mil
Thickness 0.4 ± 0.2 mil
Min. line width 5 mil
Forming V-CUT operative length 2.0″-24.0″
V-CUT slant tolerance ± 4 mil
Routing tolerance ± 5 mil
Routing 1 PCS min. width 0.315″
Routing 1 PCS min. pitch 0.080″
Punch 1 PCS min. width 0.110″
Punch 1 PCS min. pitch 0.059″
HASL Thickness min 40 μ”, max 1000 μ”
Min. operative size 4.7” x 4.7”
Max. operative size 15” x 20.5”
Immersion Gold Plated Gold thickness 2-3 u”
Min. operative size 12” x 14”
Max. operative size 21” x 24′

HDI

Item Description Capability
Material (insulation layer) RCC YES
FR4 prepreg YES
Process I/L trace and space (1.0 oz)) 3mil/3mil
I/L srace and Space (0.5 oz) 2.5mil/2.5mil
O/L trace and space 2.5mil/2.5mil
Drill through hole 8 mil
Pad over drill size 10 mil
Buried via hole size 8 mil
Blind via hole size 4 mil
AntiPad over blind via size 10 mil
Pad over blind via size 6 mil
Build up layers per side 4
Maximum aspect ratio of microvia 0.7:1
Stack via(1-2,2-3 blind via) YES
Skip via(1-3 layer blind via, skip2) NO
Via on PTH YES
Via fil capability YES

Heavy Copper

Item Description Capability
Heavy Copper Max number of layers 22
Max finished thickness 125 mil
Solder masks & legend inks YES (double coating)
Min solder mask clearance 4 mil
Final finishes ENIG / HAL/LF HAL / OSP/Imm Ag/Imm Sn
Blind & buried via capability Same as HDI
Min drill bit size 10.8 mil
Max aspect ratio 1:10
Max external Cu weight  (UL Approved) 4oz
Max internal Cu weight (UL Approved) 4oz
Controlled impedance +/-10 %
Minimum silkscreen line width 4 mil
Design Rules Feature H oz1 oz2 oz3 oz4 oz
Min conductor width 2.5 mil3 mil5 mil7 mil10 mil
Min conductor spacing 2.5 mil3 mil5 mil7 mil10 mil
Min pad to pad spacing 2.5 mil3 mil5 mil7 mil10 mil
Min conductor-to-pad spacing 2.5 mil3 mil5 mil7 mil10 mil
Min. PTH annular ring 2 mil2 mil5 mil7 mil10 mil
Min via annular ring 2 mil2 mil5 mil7 mil10 mil
Min istance – hole to board edge 6 mil6 mil6 mil6 mil6 mil